Torr Scientific services
- Vacuum brazing
- TIG welding
- Glass-to-metal seals
- Adhesive bonding
- Diffusion bonding
- Glass work
- Magnetron sputtering and reactive magnetron sputtering
- E-beam coating of dielectrics and metals
- Phosphor screen manufacture
- Thermal evaporation
- Filament thoriation
- Laser engraver
- Vacuum furnace treatments
- Vacuum bakeout and conditioning with RGA
- Helium leak checking
- UV-vis-NIR dual-beam spectrophotometer
- FTIR spectrometer
- White-light interferometer surface profiler
- Digital stereo microscope
- FEG scanning electron microscope
- Four-point probe sheet resistance meter
Precision Machine Shop:
- CNC lathe
- CNC mill
TSL have recently acquired a brand new dual magnetron sputter deposition system, supplied, installed and commissioned by Moorfield Nanotechnology Ltd. The system has an integrated plasma cleaning facility for enhanced adhesion of thin films. The instrument is computer controlled. Mass flow controllers allow precise metering of sputter gases as well as reactive gases for reactive sputtering. Introducing a reactive gas such as oxygen allows metals sputtered from a metallic target to be reactively deposited as oxides, with the stoichiometry (atomic ratios) controlled by the rate of gas delivery and deposition parameters. We are in the process of configuring the system to take over some of the dielectric coating duties currently performed by e‐beam. The new system joins several other sputter systems at TSL and will eventually be employed to deposit the thicker films needed for IR applications.
UV-vis-IR and FTIR spectrometers
TSL recently acquired a new UV-vis-NIR spectrophotometer. The Cary 5000 has a wide spectral range, covering the wavelength spectrum from 175 nm to 3300 nm. The dual-beam configuration allows absolute measurements to be made and compensates for variations in the source brightness. Its main use is measuring the optical performance of our vacuum viewports with anti-reflective coatings. It is also used to help calibrate coating processes and to characterize optical materials and coatings. The sample chamber is large enough to accommodate our more frequently manufactured viewports, but it is also adaptable for the substantially larger viewports that we manufacture less often. We have a near-normal reflectance accessory, so measurements can be made of both reflectance and transmittance as required. Its sister instrument, an Agilent Cary 630 FTIR extends our measurement capability to around 27 µm, well into the mid infrared. It can scan across the entire wavelength range in just a few seconds.
CNC-Controlled MDM-100 Mill
The TSL precision machine shop houses an MDM-100 mill and MDL-1800 lathe, both CNC‐controlled and supplied by Mach Machine Tools. In addition to welding, helium leak testing, cleaning and inspection facilities, the facility manufactures components and small UHV chambers to custom design.
CNC‐Controlled MDL-1800 Lathe
CAD Engineering drawings are produced around customer requirements and issued for customer approval before manufacturing proceeds.
Laminar Flow Cabinets
Cleaning and assembly of UHV instrumentation takes place in laminar flow cabinets in cleanroom conditions.
TSL has a new state-of-the-art Leybold Quadro helium leak detector. The mulicoloured touch screen and intuitive menus facilitate efficient and reliable leak checking of hermetic components such as viewports and X-ray anodes.
This instrument joins the existing Inficon UL 1000 helium leak checker.
Both instruments have a 180° sector field mass spectrometer as detector and can each detect helium leaks as small as 5 x 10-12 mbar L s-1.
Vapour Degreasing System
TSL has recently commissioned a new Solvac S1 Compact Vapour Degreasing System. A reservoir of low-boiling-point solvent is heated and rises into the vapour headspace. Near the top is a condenser region where a jets of cold air condenses any vapour and returns the liquid solvent to the reservoir via a filtration system. In a fully automated, user-programmed cleaning cycle, the components are lowered in a basket into the liquid solvent where they undergo ultrasound agitation. As the basket is lifted, the parts are further rinsed in the solvent vapour. As the parts progress above the condenser region they should be fully solvent-free.
The new system liberates our technicians from the slow and laborious system of water-based ultrasonic tanks that were the standard procedure prior to its arrival.
FEG Scanning Electron Microscope
TSL has a Hitachi S4000 scanning electron microscope with FEG (field-effect gun) for higher resolution.